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• Semicorp User Manuals Model 4800 Ejector Grid Number
• Semicorp User Manuals Model 4800 Ejector Grid System

We will mount a 200 mm wafer on a frame. We will not have dicing capability so we will cure the full wafer undiced on the New Model 365 UV Exposure System. Next we will remove the wafer from the tape on a Model 4800 Die Ejector Grid demonstrating the removal of die from tape without a pin poker. Mar 26, 2014 Semiconductor Equipment Corporation is the leading designer and manufacturer of a wide range of semiautomatic assembly, rework, handling, and test equipment. Semiconductor Equipment Corporation is the leading designer and manufacturer of a wide range of semiautomatic assembly, rework, handling, and test equipment. Model 430 Hot Gas Module Hot gas jet directs up to 800 degrees Celsius through an interchangeable nozzle to a specific Model 450 Hot Gas Rework Station Hot gas rework station removes surface mounted components and bonded die. Model 4750 Die Ejector Pokes die off of dicing tape. Especially useful for small die. Model 4800 Die Ejector Grid System. Model 4500 series. Vibrating Wire Piezometer. No part of this instruction manual may be reproduced. Every precaution for accuracy has been taken in the preparation of manuals and/or software, however, Geokon neither assumes responsibility for. Installation & Operation Manual model. Drive.web automation This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)This. For more information and to download manuals and software, go to.

Semicorp User Manuals Model 4800 Ejector Grid Number

Overview

A specially designed system to allow die to be loosened for quick and safe removal from plastic wafer mounting tape. Eliminate the need for ejector pins or pokers which can break die as they are being ejected from the tack on the tape.

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Description

A complete system includes a Die Ejector Grid (for .040 x .040 and larger die) mounted to a combination warming plate and vacuum chamber. A separate console houses a temperature controller, vacuum switch and power switch (see exploded view). Individual parts of the system can also be purchased separately.
In operation, a sawed or scribed wafer, mounted on a film frame or ring set, is placed over the grid, consisting of a series of closely spaced points. Vacuum and a low temperature (approximately 170°F) are applied through the grid to the back side of the wafer mounting tape. The vacuum pulls the tape from the back of the wafer into the valleys between the rows of points. Lifting the die from the tape with a tweezers, vacuum pencil or vacuum collet, is then a very simple matter. The Model 4800 will accommodate all film frames or ring mounting sets.

Specifications

Semicorp User Manuals Model 4800 Ejector Grid System

• Electric Current: 3 Amps, 115 V, 60 Hz
• Weight: 6 pounds
• Shipping Weight: 9 pounds
• Vacuum: 25'
• Size: 8'x5'x7'